Product description
The Qualcomm APQ-8053-A-792NSP-MT-01-1-AA is a powerful SoC that combines cutting-edge technology with a focus on performance, efficiency, and user experience. Its architecture is tailored to handle the increasing demands of modern mobile applications, providing a seamless experience for users.
Performance Excellence: The octa-core architecture of the APQ-8053 allows for exceptional performance across various tasks. The Cortex-A72 cores are optimized for high-performance scenarios, such as gaming and multitasking, providing users with rapid responsiveness when performing demanding operations. Meanwhile, the Cortex-A53 cores handle less intensive tasks efficiently, ensuring that the device conserves battery power when full processing capabilities are not required. This capability results in a longer battery life and improved user satisfaction.
Graphics and Multimedia: The Adreno 508 GPU empowers the APQ-8053 with robust graphics capabilities, making it suitable for high-resolution displays and graphically intense applications. The support for OpenGL ES 3.2 and Vulkan 1.0 means that developers can leverage advanced rendering techniques to create stunning visuals and immersive gaming experiences. Additionally, the SoC’s ability to handle 4K video playback and recording further enhances its multimedia prowess, allowing users to enjoy and create high-quality videos without compromising performance.
Versatile Connectivity: In an increasingly connected world, reliable connectivity is paramount. The APQ-8053 supports dual-band Wi-Fi, ensuring fast and stable internet access, while Bluetooth 5.0 provides enhanced connectivity with peripherals and other devices. The optional support for 4G LTE and 5G networks enables users to stay connected with high-speed data, facilitating smooth streaming and online gaming experiences.
AI and Machine Learning: The integration of AI capabilities within the APQ-8053 allows for innovative features such as intelligent voice assistants and real-time image enhancements. These functionalities enrich user interactions and automate processes, creating a more intuitive experience. The SoC's optimization for machine learning tasks also opens doors for future applications that rely on AI, positioning it well for the evolving landscape of mobile technology.
Thermal Management and Power Efficiency: Qualcomm’s design approach focuses on power efficiency and thermal management, which are crucial for mobile devices. The BGA package allows for effective heat dissipation, ensuring that the SoC operates within safe temperature limits even under heavy loads. This thermal efficiency contributes to overall device longevity and user satisfaction by preventing overheating and maintaining consistent performance.
In summary, the Qualcomm APQ-8053-A-792NSP-MT-01-1-AA stands out as a versatile and high-performance SoC, ideal for modern mobile devices. Its combination of powerful computing capabilities, advanced graphics, robust connectivity, and AI features positions it as a leading choice for manufacturers seeking to deliver cutting-edge technology to consumers. Whether for gaming, multimedia consumption, or productivity tasks, the APQ-8053 meets the diverse needs of today’s mobile users, providing an unparalleled user experience.
Specification parameters
CPU:
Architecture: Octa-core (4x ARM Cortex-A72 + 4x ARM Cortex-A53)
Maximum Clock Speed: Up to 2.2 GHz
GPU:
Model: Adreno 508
Supported Graphics APIs: OpenGL ES 3.2, Vulkan 1.0
Memory Support:
RAM Type: LPDDR4X
Maximum RAM Capacity: 8 GB
Memory Bus Width: 64-bit
Storage Interfaces:
Supports eMMC 5.1 and UFS 2.1 storage technologies
SD card interface for expandable storage options
Connectivity:
Wi-Fi: Dual-band 802.11a/b/g/n/ac
Bluetooth: Version 5.0
Optional support for 4G LTE and 5G connectivity based on configuration
Multimedia Capabilities:
4K video playback at up to 60 fps
4K video recording at 30 fps
Hardware support for H.264, H.265 (HEVC), and VP9 codecs
Package Type:
Package Type: BGA (Ball Grid Array)
Designed for compact integration in mobile devices, emphasizing thermal management and efficient design.