Product description
The Qualcomm APQ-8053-A-792NSP-TR-01-1-AA is engineered to provide a powerful and efficient solution for modern mobile devices. Its design combines high-performance processing with advanced graphics and multimedia capabilities, making it suitable for a wide range of applications.
High Performance with Efficiency: The octa-core CPU architecture of the APQ-8053 allows it to handle multitasking and intensive applications with ease. The high-performance Cortex-A72 cores are optimized for demanding tasks, such as gaming and video editing, while the energy-efficient Cortex-A53 cores manage less intensive operations, helping to extend battery life. This adaptive core management ensures that users experience fast and responsive performance without compromising on power efficiency.
Stunning Graphics and Multimedia: The inclusion of the Adreno 508 GPU significantly enhances the visual capabilities of the SoC. It supports high-resolution displays and advanced rendering techniques, enabling a rich visual experience for gaming and multimedia applications. With support for 4K video playback and recording, users can enjoy crisp, detailed video quality for streaming services or personal media creation. The hardware acceleration for various video codecs ensures smooth playback and efficient encoding, further appealing to content creators and consumers alike.
Robust Connectivity and Future-ready Design: Staying connected is crucial in today's digital landscape, and the APQ-8053 excels in this area. With dual-band Wi-Fi and Bluetooth 5.0, the SoC offers reliable and fast connections for streaming, browsing, and data transfer. The potential for 4G LTE and 5G support means that devices using this SoC can take advantage of the latest advancements in mobile networking, providing users with high-speed internet access on the go.
AI Integration for Enhanced User Experiences: The APQ-8053's AI capabilities allow for innovative features that enhance usability. Applications can leverage machine learning for real-time image processing, voice recognition, and other smart functionalities that make interactions more intuitive. This integration not only improves user experience but also opens avenues for future developments in mobile technology, aligning with the growing trend towards intelligent devices.
Thermal Management and Compact Design: The BGA package design of the APQ-8053 emphasizes efficient thermal management while maintaining a compact form factor. This design consideration is vital for mobile devices, where space is limited, and overheating can lead to performance throttling. By optimizing heat dissipation, the SoC maintains optimal operating temperatures even under heavy load, ensuring consistent performance and longevity for mobile devices.
In summary, the Qualcomm APQ-8053-A-792NSP-TR-01-1-AA stands out as a highly capable and versatile SoC that meets the demands of modern mobile computing. Its combination of powerful processing, advanced graphics, robust connectivity, and AI features positions it as a leading choice for manufacturers looking to deliver superior performance and user experiences in their devices. Whether for gaming, multimedia consumption, or productivity, the APQ-8053 is designed to cater to a diverse range of user needs, making it an essential component of today’s mobile technology landscape.
Specification parameters
CPU:
Architecture: Octa-core (4x ARM Cortex-A72 + 4x ARM Cortex-A53)
Maximum Clock Speed: Up to 2.2 GHz
GPU:
Model: Adreno 508
Graphics API Support: OpenGL ES 3.2, Vulkan 1.0
Memory Support:
RAM Type: LPDDR4X
Maximum RAM Capacity: 8 GB
Memory Bus Width: 64-bit
Storage Interfaces:
Supports eMMC 5.1 and UFS 2.1 storage technologies
SD card interface for expandable storage options
Connectivity:
Wi-Fi: Dual-band 802.11a/b/g/n/ac
Bluetooth: Version 5.0
Optional 4G LTE and 5G connectivity based on configuration
Multimedia Capabilities:
4K video playback at up to 60 fps
4K video recording at 30 fps
Hardware support for H.264, H.265 (HEVC), and VP9 codecs
Package Type:
Package Type: BGA (Ball Grid Array)
Designed for compact integration in mobile devices, emphasizing thermal management and efficient design.