System on Chip (SoC)

APQ-8064-1-784FCBGA-MT-02-0-AB

  • Robust Connectivity Options: The APQ-8064 features integrated connectivity solutions, including support for 3G and 4G LTE, Wi-Fi (802.11 a/b/g/n), and Bluetooth 4.0. This comprehensive connectivity ensures that devices powered by the APQ-8064 can maintain fast and reliable network connections, enhancing user experiences in mobile and embedded applications.

Product description

The Qualcomm APQ-8064-1-784FCBGA-MT-02-0-AB is a powerful and versatile system-on-chip (SoC) that excels in performance and efficiency, catering to the needs of modern mobile and embedded devices. Built on Qualcomm’s advanced Krait architecture, the APQ-8064 features a quad-core configuration that enables exceptional multitasking capabilities. With a maximum clock speed of 1.5 GHz, this SoC delivers robust processing power that is capable of handling complex applications and high-performance tasks with ease.

One of the standout features of the APQ-8064 is its Adreno 320 GPU, which provides enhanced graphics capabilities. This GPU is specifically designed to deliver smooth and visually rich experiences, making it ideal for gaming and multimedia applications. With support for advanced graphics APIs, the Adreno 320 enables developers to create visually stunning applications that take full advantage of the hardware's capabilities.

In addition to its processing power and graphics performance, the APQ-8064 is equipped with a range of connectivity options that make it suitable for various applications. It supports 3G and 4G LTE networks, allowing devices to maintain fast data connections for streaming, browsing, and online gaming. Additionally, built-in Wi-Fi (802.11 a/b/g/n) and Bluetooth 4.0 ensure that devices can connect seamlessly to other devices and networks, enhancing their overall functionality.

The APQ-8064 is also designed with multimedia capabilities in mind. It supports a maximum display resolution of 2560 x 1600 pixels, which means it can power high-resolution displays, making it suitable for tablets and high-end smartphones. This capability, combined with its support for multiple video codecs, allows for smooth playback of HD content, enriching the user experience for media consumption.

In terms of memory and storage, the APQ-8064 supports DDR3 RAM of up to 2 GB, providing ample memory for running multiple applications simultaneously without lag. The SoC also supports eMMC and SD card interfaces, allowing for flexible storage solutions that can accommodate varying user needs.

The APQ-8064 is built to operate reliably in diverse environmental conditions, with an operating temperature range of -40 °C to +85 °C. This industrial-grade specification makes it an ideal choice for a variety of applications, including automotive systems, industrial automation, and smart home devices, where reliable performance in challenging environments is crucial.

Moreover, the 784 FCBGA package type ensures a compact design, which is essential for space-constrained applications. This feature enables manufacturers to integrate the SoC into various devices without compromising on performance or functionality.

In conclusion, the Qualcomm APQ-8064-1-784FCBGA-MT-02-0-AB is a high-performance SoC that combines advanced processing capabilities, enhanced graphics performance, and robust connectivity options. Its design is optimized for a wide range of applications, making it suitable for everything from smartphones and tablets to industrial devices. With its powerful features and specifications, the APQ-8064 stands out as a leading choice for developers looking to create cutting-edge, feature-rich products in the increasingly competitive technology landscape.


Specification parameters

  • CPU Architecture: Qualcomm Krait

  • Clock Speed: Up to 1.5 GHz

  • Number of Cores: Quad-core

  • GPU: Adreno 320

  • Maximum Display Resolution: 2560 x 1600 pixels

  • Memory Support: DDR3 RAM (up to 2 GB)

  • Connectivity:

    • 3G/4G LTE support

    • Wi-Fi (802.11 a/b/g/n)

    • Bluetooth 4.0

  • Storage Options: eMMC and SD card interfaces

  • Operating Temperature Range: -40 °C to +85 °C (industrial grade)

  • Package Type: 784 FCBGA (Fine Pitch Ball Grid Array)


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