System on Chip (SoC)

APQ-8064-1-784FCBGA-MT-02-0-MB

  • High-Performance Processing: The Qualcomm APQ-8064 features a quad-core Krait CPU architecture that provides exceptional processing power. With a maximum clock speed of up to 1.5 GHz, it allows devices to handle demanding applications and multitasking scenarios efficiently. This capability is essential for mobile devices that require rapid response times and smooth user experiences.

Product description

The Qualcomm APQ-8064-1-784FCBGA-MT-02-0-MB is a powerful and versatile system-on-chip (SoC) designed to meet the increasing demands of modern mobile and embedded devices. At its core, the APQ-8064 utilizes Qualcomm’s advanced Krait architecture, which provides a significant boost in processing capabilities compared to previous generations. With its quad-core configuration, the chip is capable of efficiently handling multiple applications simultaneously, making it ideal for a wide range of devices, including smartphones, tablets, and other portable electronics.

One of the standout features of the APQ-8064 is its high-performance Adreno 320 GPU. This graphics processor is specifically engineered to deliver superior graphics performance, supporting advanced gaming and multimedia applications. With capabilities such as high-resolution rendering and support for multiple graphics APIs, the Adreno 320 allows developers to create visually stunning applications that enhance the user experience. The ability to output at a maximum display resolution of 2560 x 1600 pixels makes this SoC particularly suitable for high-end displays, ensuring that users enjoy sharp and vibrant visuals.

The APQ-8064 is also equipped with robust connectivity options that cater to the needs of modern users. It supports both 3G and 4G LTE connectivity, allowing for fast data transmission and seamless internet access. Additionally, with integrated Wi-Fi (802.11 a/b/g/n) and Bluetooth 4.0, devices powered by this SoC can easily connect to a variety of networks and peripherals, enhancing their overall functionality. This versatility is crucial for users who rely on constant connectivity for streaming, gaming, and other online activities.

In terms of memory and storage, the APQ-8064 supports DDR3 RAM of up to 2 GB, providing sufficient memory for running multiple applications smoothly. The integration of eMMC and SD card interfaces allows for flexible storage options, accommodating varying user needs and enabling easy expansion of device storage.

The design of the APQ-8064 ensures reliability and durability, with an operating temperature range of -40 °C to +85 °C. This industrial-grade specification makes it suitable for a variety of applications, including automotive systems, industrial automation, and IoT devices, where performance must be maintained in challenging environmental conditions.

Moreover, the 784 FCBGA package type facilitates a compact design, which is essential for space-constrained applications. This feature enables manufacturers to integrate the SoC into various devices without compromising on performance or functionality, making it a versatile choice for different market segments.

In conclusion, the Qualcomm APQ-8064-1-784FCBGA-MT-02-0-MB is a highly capable SoC that combines advanced processing capabilities, superior graphics performance, and versatile connectivity options. Its design is optimized for a wide range of applications, making it suitable for everything from smartphones and tablets to industrial devices. With its powerful features and specifications, the APQ-8064 stands out as a leading choice for developers seeking to create cutting-edge, feature-rich products in an increasingly competitive technology landscape.


Specification parameters

  • CPU Architecture: Quad-core Qualcomm Krait

  • Clock Speed: Up to 1.5 GHz

  • GPU: Adreno 320

  • Maximum Display Resolution: 2560 x 1600 pixels

  • Memory Support: DDR3 RAM (up to 2 GB)

  • Connectivity:

    • 3G/4G LTE support

    • Wi-Fi (802.11 a/b/g/n)

    • Bluetooth 4.0

  • Storage Options: eMMC and SD card interfaces

  • Operating Temperature Range: -40 °C to +85 °C (industrial grade)

  • Package Type: 784 FCBGA (Fine Pitch Ball Grid Array)


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