System on Chip (SoC)

APQ-8064-3-839BPNSP-MT-02-0-AB

  • Robust Connectivity Options: The APQ-8064-3 provides comprehensive connectivity solutions, including support for 3G and 4G LTE, Wi-Fi (802.11 a/b/g/n), and Bluetooth 4.0. These features ensure that devices powered by this SoC can maintain fast and reliable internet connections, enabling seamless streaming, browsing, and communication. The integration of multiple connectivity options is essential in today’s increasingly connected environment.

Product description

The Qualcomm APQ-8064-3-839BPNSP-MT-02-0-AB is a highly sophisticated system-on-chip (SoC) designed to meet the growing demands of modern mobile and embedded applications. At its core, the APQ-8064-3 leverages Qualcomm's advanced Krait architecture, which enhances both processing power and energy efficiency. The quad-core configuration, operating at clock speeds of up to 1.9 GHz, allows the SoC to excel in handling a wide range of applications, making it ideal for smartphones, tablets, and other high-performance devices.

One of the key features of the APQ-8064-3 is its powerful Adreno 320 GPU. This graphics processor is optimized for high-end graphics rendering, providing the performance necessary for demanding gaming and multimedia applications. The Adreno 320 supports various graphics APIs and advanced techniques, enabling developers to create immersive experiences with rich textures and smooth animations. With the ability to support a maximum display resolution of 2560 x 1600 pixels, the SoC ensures that users enjoy crisp and vibrant visuals, enhancing the overall experience in gaming, video playback, and graphic-intensive tasks.

Connectivity is a standout feature of the APQ-8064-3, offering a wide range of options that enhance device functionality. With built-in support for 3G and 4G LTE, the SoC allows for rapid mobile data access, ensuring that users can stream content and browse the internet without interruption. Additionally, the inclusion of Wi-Fi (802.11 a/b/g/n) enables high-speed wireless connectivity, while Bluetooth 4.0 facilitates low-energy communication with other devices, such as peripherals and accessories. This combination of connectivity options makes the APQ-8064-3 well-suited for various applications in today’s connected world.

In terms of memory and storage, the APQ-8064-3 supports DDR3 RAM of up to 2 GB, providing ample memory for running multiple applications smoothly. This capability is crucial for multitasking scenarios, where users expect seamless performance across various tasks. The SoC also includes support for eMMC and SD card interfaces, offering flexible storage solutions that can accommodate the diverse needs of users who require additional storage for apps, media, and documents.

The APQ-8064-3 is designed with reliability in mind, featuring an operating temperature range of -40 °C to +85 °C. This industrial-grade specification ensures that the SoC can perform consistently in harsh environments, making it suitable for applications in automotive, industrial, and IoT sectors where temperature fluctuations can occur.

The 839 BPNSP package type allows for a compact and efficient design, which is critical for modern electronics where space is often limited. This packaging solution enables manufacturers to integrate the SoC into a variety of devices without compromising on performance or reliability.

In summary, the Qualcomm APQ-8064-3-839BPNSP-MT-02-0-AB is a powerful and versatile SoC that combines advanced processing capabilities, exceptional graphics performance, and comprehensive connectivity options. Its architecture is optimized for a wide range of applications, making it ideal for high-end smartphones, tablets, and embedded devices. With its robust specifications and reliable performance, the APQ-8064-3 stands out as a leading solution for developers aiming to create cutting-edge products in an increasingly competitive technology landscape.


Specification parameters

  • CPU Architecture: Quad-core Qualcomm Krait

  • Clock Speed: Up to 1.9 GHz

  • GPU: Adreno 320

  • Maximum Display Resolution: 2560 x 1600 pixels

  • Memory Support: DDR3 RAM (up to 2 GB)

  • Connectivity:

    • 3G/4G LTE support

    • Wi-Fi (802.11 a/b/g/n)

    • Bluetooth 4.0

  • Storage Options: eMMC and SD card interfaces

  • Operating Temperature Range: -40 °C to +85 °C (industrial grade)

  • Package Type: 839 BPNSP (Plastic No-Slump Package)

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