System on Chip (SoC)

APQ-8064-3-839BPNSP-TR-02-0-AB

  • High-Performance Quad-Core Processing: The Qualcomm APQ-8064-3 features a quad-core Krait CPU architecture, which operates at clock speeds of up to 1.9 GHz. This multi-core design enables exceptional performance across various applications, making it ideal for high-demand tasks such as gaming, video streaming, and multitasking. The Krait architecture is engineered for high efficiency, providing a balance between performance and power consumption, which is crucial for mobile devices.

Product description

The Qualcomm APQ-8064-3-839BPNSP-TR-02-0-AB is a highly capable system-on-chip (SoC) designed to meet the rigorous demands of modern mobile and embedded devices. Built on Qualcomm's advanced Krait architecture, this SoC offers a significant leap in processing capabilities and energy efficiency. The quad-core Krait CPU can operate at speeds of up to 1.9 GHz, enabling it to handle a variety of applications with ease, from complex gaming scenarios to demanding multitasking environments.

One of the standout features of the APQ-8064-3 is its Adreno 320 GPU, which plays a crucial role in delivering an exceptional graphics experience. This GPU is designed to support high-definition gaming and multimedia applications, ensuring that users can enjoy rich graphics and fluid animations. The ability to output at a maximum display resolution of 2560 x 1600 pixels makes it particularly suitable for high-end devices requiring top-notch visual performance. Developers can leverage the GPU's capabilities to create immersive applications that engage users with stunning visuals.

Connectivity is another critical aspect of the APQ-8064-3. It provides robust support for various networking options, including 3G and 4G LTE, which enable fast mobile data access. This capability is essential for users who rely on their devices for streaming content, browsing the internet, and engaging with cloud-based services. In addition to cellular connectivity, the SoC also features Wi-Fi (802.11 a/b/g/n), which allows for high-speed wireless internet access, and Bluetooth 4.0 for low-energy device communication. This combination of connectivity options ensures that devices powered by the APQ-8064-3 can stay connected in diverse environments, enhancing user experience and functionality.

From a memory and storage perspective, the APQ-8064-3 supports DDR3 RAM of up to 2 GB, which allows for smooth operation of multiple applications simultaneously. This is particularly important for modern mobile applications that often require significant memory resources. The SoC also includes support for eMMC and SD card interfaces, providing users with flexible storage options to accommodate their data needs, such as apps, media, and files.

Designed for reliability, the APQ-8064-3 has an operating temperature range of -40 °C to +85 °C, making it suitable for a variety of industrial and automotive applications. This industrial-grade specification ensures that the SoC can function effectively in challenging environments where temperature fluctuations may occur, providing consistent performance across different conditions.

The 839 BPNSP package type allows for a compact design, which is essential for modern electronics where space is often at a premium. This packaging solution makes it easier for manufacturers to integrate the SoC into a wide range of devices without sacrificing performance or reliability.

In conclusion, the Qualcomm APQ-8064-3-839BPNSP-TR-02-0-AB is a powerful and versatile SoC that combines high-performance processing, advanced graphics capabilities, and extensive connectivity options. Its design is optimized for a variety of applications, making it an ideal choice for high-end smartphones, tablets, and embedded devices. With robust specifications and reliable performance, the APQ-8064-3 stands out as a leading solution for developers seeking to create innovative products in an increasingly competitive technology landscape.


Specification parameters

  • CPU Architecture: Quad-core Qualcomm Krait

  • Clock Speed: Up to 1.9 GHz

  • GPU: Adreno 320

  • Maximum Display Resolution: 2560 x 1600 pixels

  • Memory Support: DDR3 RAM (up to 2 GB)

  • Connectivity:

    • 3G/4G LTE support

    • Wi-Fi (802.11 a/b/g/n)

    • Bluetooth 4.0

  • Storage Options: eMMC and SD card interfaces

  • Operating Temperature Range: -40 °C to +85 °C (industrial grade)

  • Package Type: 839 BPNSP (Plastic No-Slump Package)


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