System on Chip (SoC)

APQ-8074-0-990BPNSP-MT-01-0-AB

  • Enhanced Graphics Capabilities: Equipped with the Adreno 330 GPU, the APQ-8074-0 delivers impressive graphics performance. This GPU supports advanced rendering techniques and high-resolution displays, providing smooth visuals and high frame rates in gaming and multimedia applications. The maximum display resolution supported is 2560 x 1600 pixels, making it suitable for high-definition content and immersive experiences on modern devices.

Product description

The Qualcomm APQ-8074-0-990BPNSP-MT-01-0-AB is a state-of-the-art system-on-chip (SoC) that caters to the performance demands of modern mobile and embedded devices. Built on Qualcomm's advanced Krait architecture, this SoC provides a significant boost in processing capabilities while optimizing energy efficiency. The quad-core Krait CPU operates at speeds of up to 2.3 GHz, making it highly capable of handling resource-intensive tasks, such as high-performance gaming, video editing, and multitasking between demanding applications.

A standout feature of the APQ-8074-0 is its integrated Adreno 330 GPU, which significantly enhances the graphics performance of devices. This GPU is optimized for high-definition graphics and advanced rendering techniques, providing users with a rich visual experience in gaming and multimedia applications. The capability to support a maximum display resolution of 2560 x 1600 pixels ensures that users can enjoy crisp, vibrant images and fluid animations, making the SoC ideal for devices designed for entertainment and content consumption.

In terms of connectivity, the APQ-8074-0 offers a robust suite of options that are crucial for modern applications. With support for 4G LTE, the SoC allows devices to access fast mobile data networks, ensuring seamless streaming and browsing experiences. The integrated Wi-Fi (802.11 a/b/g/n) provides high-speed wireless internet connectivity, while Bluetooth 4.0 allows for low-energy communication with various devices, such as headphones, speakers, and smart accessories. This comprehensive connectivity ensures that devices powered by the APQ-8074-0 remain connected in diverse environments, enhancing usability and convenience.

The memory and storage capabilities of the APQ-8074-0 further enhance its performance. Supporting DDR3 RAM of up to 3 GB allows the SoC to handle multiple applications smoothly, providing an optimal multitasking experience. This is particularly important in today’s mobile landscape, where users expect responsive performance even with numerous apps running simultaneously. The inclusion of eMMC and SD card interfaces offers flexible storage solutions, enabling users to expand their device's storage capacity as needed.

Designed with reliability in mind, the APQ-8074-0 features an operating temperature range of -40 °C to +85 °C, making it suitable for various industrial and automotive applications. This industrial-grade specification ensures consistent performance in harsh environments, where temperature fluctuations can impact device functionality.

The 990 BPNSP package type allows for a compact and efficient design, which is essential in modern electronics where space is often at a premium. This packaging solution facilitates integration into various devices, enabling manufacturers to leverage the APQ-8074-0’s capabilities without compromising on performance or reliability.

In conclusion, the Qualcomm APQ-8074-0-990BPNSP-MT-01-0-AB is a powerful and versatile SoC that combines high-performance processing, enhanced graphics capabilities, and comprehensive connectivity options. Its design is optimized for a wide range of applications, making it an ideal choice for high-end smartphones, tablets, and embedded devices. With its robust specifications and reliable performance, the APQ-8074-0 stands out as a leading solution for developers seeking to create innovative products in an increasingly competitive technology landscape.


Specification parameters

  • CPU Architecture: Quad-core Qualcomm Krait

  • Clock Speed: Up to 2.3 GHz

  • GPU: Adreno 330

  • Maximum Display Resolution: 2560 x 1600 pixels

  • Memory Support: DDR3 RAM (up to 3 GB)

  • Connectivity:

    • 4G LTE support

    • Wi-Fi (802.11 a/b/g/n)

    • Bluetooth 4.0

  • Storage Options: eMMC and SD card interfaces

  • Operating Temperature Range: -40 °C to +85 °C (industrial grade)

  • Package Type: 990 BPNSP (Plastic No-Slump Package)


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