Product description
The Qualcomm APQ-8074-0-990BPNSP-MT-06-0 is a cutting-edge system-on-chip (SoC) that caters to the growing demands of modern mobile and embedded applications. Built on Qualcomm's innovative Krait architecture, this SoC provides a significant increase in processing power while optimizing energy efficiency. The quad-core configuration, which can clock up to 2.3 GHz, enables the APQ-8074-0 to tackle resource-intensive tasks effectively, making it ideal for high-performance smartphones, tablets, and other advanced devices.
A major highlight of the APQ-8074-0 is its integrated Adreno 330 GPU, which dramatically enhances the graphics performance of devices. This graphics processor is engineered to deliver an exceptional visual experience, supporting high-definition graphics and advanced rendering techniques. The ability to output at a maximum display resolution of 2560 x 1600 pixels ensures that users can enjoy stunning visuals, whether they are gaming, watching videos, or using graphic-intensive applications. The Adreno 330’s optimization for various graphics APIs allows developers to create rich and immersive applications that leverage the full potential of modern displays.
Connectivity is a crucial aspect of the APQ-8074-0, as it offers a wide range of options that are essential for contemporary applications. The SoC supports 4G LTE, enabling devices to access fast mobile data networks and providing users with seamless streaming and browsing capabilities. Additionally, the integration of Wi-Fi (802.11 a/b/g/n) facilitates high-speed wireless internet access, while Bluetooth 4.0 allows for low-energy connections with other devices, such as wireless headphones and peripherals. This combination of connectivity features ensures that devices powered by the APQ-8074-0 remain connected and functional in various environments.
The APQ-8074-0 also excels in memory and storage capabilities, supporting DDR3 RAM of up to 3 GB. This ample memory allows for smooth multitasking, enabling users to run multiple applications without experiencing lag or performance degradation. The SoC’s support for eMMC and SD card interfaces provides flexibility in storage options, accommodating users' needs for app installations, media files, and documents.
Reliability is another hallmark of the APQ-8074-0, which is designed to operate within an industrial-grade temperature range of -40 °C to +85 °C. This robust specification makes the SoC suitable for a wide array of applications, including industrial and automotive use cases where environmental conditions can vary significantly. The ability to maintain consistent performance under challenging conditions is a key advantage for manufacturers seeking to deploy reliable devices.
The 990 BPNSP package type allows for a compact design that is essential for modern electronics, where space efficiency is crucial. This packaging solution enables manufacturers to integrate the SoC seamlessly into various devices, maximizing performance while minimizing space usage.
In summary, the Qualcomm APQ-8074-0-990BPNSP-MT-06-0 is a high-performance and versatile system-on-chip that combines powerful processing capabilities, superior graphics performance, and comprehensive connectivity options. Its design is optimized for a diverse range of applications, making it an excellent choice for high-end smartphones, tablets, and embedded systems. With its robust specifications and reliable performance, the APQ-8074-0 stands out as a leading solution for developers aiming to create innovative products in a competitive technology landscape.
Specification parameters
CPU Architecture: Quad-core Qualcomm Krait
Clock Speed: Up to 2.3 GHz
GPU: Adreno 330
Maximum Display Resolution: 2560 x 1600 pixels
Memory Support: DDR3 RAM (up to 3 GB)
Connectivity:
4G LTE support
Wi-Fi (802.11 a/b/g/n)
Bluetooth 4.0
Storage Options: eMMC and SD card interfaces
Operating Temperature Range: -40 °C to +85 °C (industrial grade)
Package Type: 990 BPNSP (Plastic No-Slump Package)