System on Chip (SoC)

APQ-8074-1-990BPNSP-MT-06-0-AB

  • Comprehensive Connectivity Options: The APQ-8074-1 features a wide range of connectivity solutions, including support for 4G LTE, Wi-Fi (802.11 a/b/g/n), and Bluetooth 4.0. These connectivity features enable devices to maintain fast and reliable internet access, facilitating seamless streaming, browsing, and communication. The ability to connect to multiple networks and devices enhances the user experience, making this SoC suitable for a variety of applications, from smartphones to tablets.

Product description

The Qualcomm APQ-8074-1-990BPNSP-MT-06-0-AB is an advanced system-on-chip (SoC) designed to meet the high-performance demands of modern mobile and embedded applications. Leveraging Qualcomm's Krait architecture, this SoC offers a significant boost in processing capabilities while maintaining high energy efficiency. The quad-core Krait CPU operates at speeds of up to 2.3 GHz, allowing the APQ-8074-1 to handle resource-intensive tasks with ease. This makes it an excellent choice for high-end smartphones, tablets, and various consumer electronics.

One of the standout features of the APQ-8074-1 is its integrated Adreno 330 GPU, which provides superior graphics performance. The GPU’s ability to support resolutions up to 2560 x 1600 pixels ensures that users experience sharp, vibrant images and smooth video playback. This is particularly advantageous for gaming, where high frame rates and detailed graphics are critical for an immersive experience. The Adreno 330 is optimized for various graphics APIs, enabling developers to create visually stunning applications that take full advantage of the GPU's capabilities.

Connectivity is a crucial component of the APQ-8074-1, which offers a robust set of options to ensure devices remain connected. With support for 4G LTE, users can enjoy fast mobile data speeds, making it ideal for streaming content, video conferencing, and online gaming. The inclusion of Wi-Fi (802.11 a/b/g/n) allows for high-speed wireless internet access, while Bluetooth 4.0 enables low-energy connections to a variety of peripherals, such as headphones, speakers, and smart devices. This combination of connectivity features enhances the overall user experience and versatility of devices powered by the APQ-8074-1.

In terms of memory and storage, the APQ-8074-1 supports DDR3 RAM of up to 3 GB, facilitating smooth multitasking and efficient application performance. This capacity is crucial in today’s mobile environment, where users expect to run multiple applications simultaneously without experiencing lag. Additionally, the SoC supports both eMMC and SD card interfaces, providing flexible storage options that can accommodate a wide range of user needs for apps, media, and other data.

Reliability is another key aspect of the APQ-8074-1, which is designed to operate within an industrial-grade temperature range of -40 °C to +85 °C. This robust specification ensures that the SoC maintains consistent performance in various environmental conditions, making it suitable for applications in industrial settings, automotive systems, and other demanding environments.

The 990 BPNSP package type allows for a compact design, which is essential in modern electronics where space is often at a premium. This packaging solution enables manufacturers to integrate the SoC into a wide array of devices while maximizing performance and minimizing footprint.

In summary, the Qualcomm APQ-8074-1-990BPNSP-MT-06-0-AB is a powerful and versatile system-on-chip that combines high-performance processing, advanced graphics capabilities, and comprehensive connectivity options. Its design is optimized for a wide range of applications, making it an ideal choice for high-end smartphones, tablets, and embedded systems. With robust specifications and reliable performance, the APQ-8074-1 stands out as a leading solution for developers aiming to create innovative products in a competitive technology landscape.


Specification parameters

  • CPU Architecture: Quad-core Qualcomm Krait

  • Clock Speed: Up to 2.3 GHz

  • GPU: Adreno 330

  • Maximum Display Resolution: 2560 x 1600 pixels

  • Memory Support: DDR3 RAM (up to 3 GB)

  • Connectivity:

    • 4G LTE support

    • Wi-Fi (802.11 a/b/g/n)

    • Bluetooth 4.0

  • Storage Options: eMMC and SD card interfaces

  • Operating Temperature Range: -40 °C to +85 °C (industrial grade)

  • Package Type: 990 BPNSP (Plastic No-Slump Package)


Product view

Related products