Product description
The Qualcomm APQ-8076-0-747PNSP-TR-01-0-AA is a powerful system-on-chip (SoC) that exemplifies the integration of advanced processing capabilities and high-performance graphics in a compact design. Tailored for modern mobile devices, this SoC is particularly well-suited for smartphones, tablets, and various embedded systems that demand both performance and efficiency.
At the heart of the APQ-8076-0 is its dual-core Krait CPU, which operates at clock speeds of up to 1.7 GHz. This architecture allows for effective multitasking and fast application performance, enabling users to switch seamlessly between applications and enjoy smooth operation. The Krait design is known for its efficiency, ensuring that power consumption is optimized without compromising on performance. This balance is crucial in mobile devices, where battery life is a primary concern for consumers.
Complementing the CPU is the integrated Adreno 320 GPU, which enhances the visual experience of the devices using this SoC. Capable of supporting display resolutions up to 1920 x 1200 pixels, the Adreno 320 provides stunning graphics for gaming and multimedia playback. Users can expect high frame rates and rich detail, contributing to a more immersive experience whether they are playing games or watching high-definition videos. The GPU’s architecture allows for efficient rendering of complex graphics, making it an essential component for any device targeting high-performance applications.
Connectivity features are a standout aspect of the APQ-8076-0. With support for 4G LTE, users can experience high-speed mobile data access, making it ideal for activities such as streaming video, video conferencing, and online gaming. The integration of Wi-Fi (802.11 a/b/g/n) ensures that devices can connect to local networks for reliable internet access, while Bluetooth 4.0 support allows for easy pairing with a range of peripherals, from headphones to smartwatches. This robust connectivity suite enhances the usability and functionality of devices equipped with this SoC.
The memory support for the APQ-8076-0 includes DDR3 RAM of up to 2 GB, which is sufficient for most modern applications. This allows for quick access to applications and efficient multitasking, ensuring that users can run multiple tasks simultaneously without experiencing significant slowdowns. Additionally, the SoC supports both eMMC and SD card storage options, providing flexibility in data storage and management.
Designed for reliability, the APQ-8076-0 operates within an industrial-grade temperature range of -40 °C to +85 °C. This wide operating temperature range makes it suitable for a variety of applications, including those in challenging environments such as industrial settings or automotive systems, where consistent performance is essential.
The 747 PNSP package type contributes to the compact design of the SoC, allowing manufacturers to integrate it into a wide range of devices while maintaining performance. This compactness is vital in modern electronic design, where space is often limited, enabling the creation of sleek and efficient devices.
In conclusion, the Qualcomm APQ-8076-0-747PNSP-TR-01-0-AA is a versatile and powerful system-on-chip that combines advanced processing power, high-performance graphics, and comprehensive connectivity options. Its design is optimized for a variety of applications, making it an excellent choice for smartphones, tablets, and embedded systems. With robust specifications and reliable performance, the APQ-8076-0 is well-positioned as a leading solution for developers looking to create innovative and efficient products in the competitive technology landscape.
Specification parameters
CPU Architecture: Dual-core Qualcomm Krait
Clock Speed: Up to 1.7 GHz
GPU: Adreno 320
Maximum Display Resolution: 1920 x 1200 pixels
Memory Support: DDR3 RAM (up to 2 GB)
Connectivity:
4G LTE support
Wi-Fi (802.11 a/b/g/n)
Bluetooth 4.0
Storage Options: eMMC and SD card interfaces
Operating Temperature Range: -40 °C to +85 °C (industrial grade)
Package Type: 747 PNSP (Plastic No-Slump Package)