Product description
The Qualcomm APQ-8084-1-994MNSP-MT-01-0-EA represents a significant evolution in mobile processing technology, designed to cater to the demanding needs of contemporary mobile devices. With its advanced octa-core Krait CPU, this system-on-chip (SoC) delivers remarkable performance, making it an ideal choice for high-end smartphones, tablets, and embedded systems.
At the heart of the APQ-8084-1 is its octa-core Krait CPU, which operates at clock speeds reaching up to 2.0 GHz. This architecture not only enhances processing power but also optimizes energy consumption, a crucial aspect for mobile devices. The Krait CPU's ability to dynamically allocate tasks across its cores enables efficient multitasking, allowing users to run demanding applications and switch between tasks seamlessly. Whether users are gaming, streaming high-definition content, or utilizing productivity applications, the APQ-8084-1 ensures a fluid experience.
Complementing the CPU is the integrated Adreno 420 GPU, which brings high-quality graphics to the forefront. With the capability to support display resolutions up to 2560 x 1600 pixels, the Adreno 420 enhances visual experiences across various applications. This GPU is engineered for high-performance gaming and multimedia playback, providing smooth frame rates and detailed graphics rendering. As mobile gaming and augmented reality applications become increasingly popular, the graphics capabilities of the APQ-8084-1 position it as an excellent choice for developers and users alike.
Connectivity is a standout feature of the APQ-8084-1, with support for 4G LTE, which enables users to access high-speed mobile internet for seamless streaming and online interactions. Additionally, the SoC supports Wi-Fi (802.11 a/b/g/n/ac), allowing devices to connect to local networks for reliable internet access. The dual-band Wi-Fi capability ensures that users can select the optimal frequency for better performance, especially in crowded network environments. Bluetooth 4.1 further enhances connectivity, allowing easy pairing with various devices, including headphones, smartwatches, and other peripherals, thereby expanding the functionality of devices powered by this SoC.
Memory support for the APQ-8084-1 includes DDR3/LPDDR3 RAM with capacities of up to 4 GB, providing ample memory for efficient multitasking and application performance. This configuration allows devices to handle multiple applications and processes without lag, ensuring that users can enjoy a smooth experience even with resource-intensive tasks.
Designed for reliability, the APQ-8084-1 operates effectively within a wide industrial-grade temperature range of -40 °C to +85 °C. This robustness makes it suitable for use in various environments, including industrial applications, automotive systems, and consumer electronics, where consistent performance is critical.
The 994 MNSP package type allows for a compact design, facilitating integration into a variety of devices without sacrificing performance. This compactness is essential in modern electronics, where space constraints often dictate design choices, enabling manufacturers to create sleek, high-performance products.
In summary, the Qualcomm APQ-8084-1-994MNSP-MT-01-0-EA is a powerful and versatile system-on-chip that combines cutting-edge processing power, advanced graphics capabilities, and comprehensive connectivity options. Its design is optimized for a wide range of applications, making it an excellent choice for high-end smartphones, tablets, and embedded systems. With robust specifications and reliable performance, the APQ-8084-1 is positioned as a leading solution for developers seeking to create innovative products in a competitive technology landscape.
Specification parameters
CPU Architecture: Octa-core Qualcomm Krait
Clock Speed: Up to 2.0 GHz
GPU: Adreno 420
Maximum Display Resolution: 2560 x 1600 pixels
Memory Support: DDR3/LPDDR3 RAM (up to 4 GB)
Connectivity:
4G LTE support
Wi-Fi (802.11 a/b/g/n/ac)
Bluetooth 4.1
Storage Options: eMMC and microSD support
Operating Temperature Range: -40 °C to +85 °C (industrial grade)
Package Type: 994 MNSP (Plastic No-Slump Package)