Product Description
The Qualcomm QRB-5165N-3-FCBGA1075+HS-MT-00-0-AA is a cutting-edge System on Chip (SoC) engineered for high-performance computing and connectivity applications. Its design integrates a powerful octa-core CPU with a sophisticated GPU, delivering a balance of high computational capability and efficient energy use.
The CPU within the QRB-5165N-3 features a heterogeneous architecture, combining high-performance cores for demanding tasks and power-efficient cores for routine operations. This design optimizes both speed and energy consumption, catering to applications that require intensive processing power as well as those that prioritize battery life.
The GPU integrated into the SoC supports high-resolution displays and advanced graphical processing, making it ideal for applications such as gaming, augmented reality (AR), and virtual reality (VR). Its ability to handle complex visual effects and high-quality graphics ensures a smooth and immersive user experience.
Connectivity is a key strength of the QRB-5165N-3. The SoC supports advanced 5G networks, providing fast data transfer and low latency essential for real-time communication and high-speed internet access. Additionally, it includes support for Wi-Fi 6, which enhances wireless network performance with improved speed and efficiency, and modern Bluetooth capabilities for seamless peripheral connectivity.
Energy efficiency is a hallmark of the QRB-5165N-3 design. The SoC's advanced power management features enable high performance while effectively managing power consumption. This is crucial for portable devices and embedded systems where battery life and energy use are critical factors.
Security is a significant aspect of the QRB-5165N-3. It incorporates multiple layers of protection, including hardware-based encryption, secure boot mechanisms, and a trusted execution environment (TEE). These features are designed to safeguard sensitive data and ensure secure operation in various connected environments.
Housed in a FCBGA (Flip-Chip Ball Grid Array) package with 1075 balls, the QRB-5165N-3 ensures reliable electrical connections and efficient thermal management. Its wide operating temperature range, from -40°C to +85°C, allows it to perform reliably in a variety of environmental conditions, from industrial settings to consumer electronics.
In summary, the Qualcomm QRB-5165N-3-FCBGA1075+HS-MT-00-0-AA is a high-performance, versatile SoC that combines powerful processing capabilities with advanced connectivity, security, and energy efficiency. Its design makes it suitable for a broad range of applications, offering robust performance and reliability in diverse scenarios.
Specification
Processor Architecture: The SoC features an octa-core CPU with a combination of high-performance and power-efficient cores. Specific details might include:
High-Performance Cores: For demanding computational tasks.
Power-Efficient Cores: To handle less intensive operations and enhance energy efficiency.
Graphics Processing Unit (GPU): Includes a high-performance GPU capable of supporting advanced graphics and visual effects. The GPU specifications should be detailed in the datasheet for precise performance metrics.
Memory Support: The QRB-5165N-3 supports advanced memory technologies such as LPDDR4X or LPDDR5, providing high-speed data access and efficient multitasking. Exact memory configurations and bandwidth details should be verified from the datasheet.
Connectivity Features:
5G: Offers support for high-speed mobile data networks, enhancing connectivity and data transfer rates.
Wi-Fi 6: Provides improved wireless network performance and efficiency.
Bluetooth: Includes modern Bluetooth capabilities for wireless peripheral communication.
Security Features: Integrated security features include:
Hardware-Based Encryption: To safeguard data and communications.
Secure Boot: Ensures that only authorized software is executed.
Trusted Execution Environment (TEE): For secure execution of sensitive processes.
Power Requirements: Operates within a standard voltage range, typically from 1.0V to 1.2V, depending on operational modes and configurations.
Package Type: The SoC is packaged in a FCBGA (Flip-Chip Ball Grid Array) configuration with 1075 balls. This packaging ensures reliable electrical connections and effective thermal management.
Temperature Range: Designed to operate within a broad temperature range, generally from -40°C to +85°C, making it suitable for diverse environmental conditions.
