System on Chip (SoC)

QSC-1100-0-2844CSP-TR-06

  • High Integration: The QSC-1100-0 integrates multiple functions into a single chip, including processing, communication, and interface functions. This high level of integration simplifies design, reduces component count, and enhances system reliability.
  • Advanced Connectivity: The SoC supports various communication protocols and standards, making it versatile for different applications. It is designed to support cellular communications, including 3G and 4G LTE, enabling robust connectivity and data transfer.

Product Description

The Qualcomm QSC-1100-0-2844CSP-TR-06 is a sophisticated System on Chip (SoC) designed to address the needs of modern communication and processing applications. It integrates multiple essential functions into a single compact package, providing a comprehensive solution for a wide range of devices.

The core of the QSC-1100-0 is its multi-core CPU, which delivers robust processing capabilities for various tasks. The CPU's architecture ensures efficient handling of both communication and multimedia functions, making it suitable for applications requiring real-time processing and high-speed data handling. The integrated GPU further enhances the SoC's capabilities by providing support for high-quality graphics and multimedia content, ensuring smooth performance for graphical applications.

Connectivity is a major strength of the QSC-1100-0. It supports essential cellular communication standards, including 3G and 4G LTE, allowing for reliable mobile data transfer and connectivity. This feature is crucial for devices that require consistent and fast network access. Additionally, the SoC supports various standard interfaces such as USB, I2C, and SPI, enabling connectivity with a wide range of peripherals and external devices.

Power efficiency is a key design consideration for the QSC-1100-0. The SoC is engineered to minimize power consumption, which is important for extending battery life in portable and energy-sensitive devices. Its efficient power management helps reduce operational costs and heat generation, making it suitable for compact and battery-operated applications.

The QSC-1100-0 is housed in a Chip Scale Package (CSP), which provides a compact and space-efficient form factor. The CSP design ensures reliable electrical connections and effective thermal management while fitting into space-constrained applications. The small size of the package allows for integration into devices where space is at a premium.

The SoC is also designed to operate across a broad temperature range, typically from -40°C to +85°C. This wide operating temperature range ensures reliable performance in various environmental conditions, from industrial settings to consumer electronics.

In summary, the Qualcomm QSC-1100-0-2844CSP-TR-06 is a highly integrated, versatile SoC that combines advanced processing, connectivity, and power efficiency. Its design makes it well-suited for a broad range of applications, offering reliable performance and compact integration for modern devices.


Specification

  • Processor Configuration: The SoC features a multi-core CPU designed for efficient processing. Specific details on core count and clock speeds are typically found in the datasheet. The CPU configuration supports various processing tasks, including communication and multimedia applications.

  • Graphics Processing Unit (GPU): Includes an integrated GPU capable of handling graphical tasks and multimedia processing. The GPU specifications, such as performance metrics and supported resolutions, should be checked in the datasheet.

  • Connectivity Support:

    • Cellular: Supports 3G and 4G LTE standards for reliable mobile data connectivity.

    • Additional Interfaces: Includes support for various standard interfaces such as USB, I2C, and SPI, facilitating connectivity with peripherals and other devices.

  • Memory: The SoC supports standard memory types, such as LPDDR2 or LPDDR3, depending on the application requirements. Memory specifications, including maximum capacity and bandwidth, are detailed in the datasheet.

  • Power Consumption: Designed for low power consumption, the SoC operates efficiently to extend battery life and reduce heat generation. Power specifications, including typical and maximum power usage, should be referenced from the datasheet.

  • Package Type: The QSC-1100-0 is housed in a Chip Scale Package (CSP) with a specific pin count and layout. The CSP package allows for a compact form factor while ensuring reliable electrical connections.

  • Temperature Range: Operates within a standard temperature range suitable for various environments, typically from -40°C to +85°C. This makes the SoC adaptable to different operating conditions.


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