System on Chip (SoC)

QSC-1100-0-284CSP-MT-03

  • Advanced Communication Support: The SoC supports a range of communication protocols, including 3G and 4G LTE. This makes it suitable for applications that require robust and reliable mobile data connectivity.
  • Efficient Processing Power: The QSC-1100-0-284 features a capable CPU and GPU configuration. The CPU handles general processing tasks efficiently, while the GPU supports multimedia applications, ensuring smooth operation for graphics-intensive applications.

Product description

The Qualcomm QSC-1100-0-284CSP-MT-03 is a sophisticated System on Chip (SoC) that integrates several critical functions into a single compact package, making it suitable for a wide array of communication and processing applications.

At its core, the QSC-1100-0-284 features a multi-core CPU designed to handle a broad range of tasks efficiently. This includes processing for communication functions and handling general-purpose computing tasks. The specific configuration of the CPU ensures that it can manage both high-performance and low-power tasks, depending on the application's needs.

The integrated GPU in the QSC-1100-0-284 provides substantial graphics processing power, supporting high-resolution displays and complex visual effects. This capability is crucial for applications involving multimedia content, gaming, or other graphics-intensive tasks. The GPU's performance ensures that the SoC can deliver a smooth and responsive user experience.

Connectivity is a key feature of the QSC-1100-0-284. The SoC supports 3G and 4G LTE cellular standards, providing reliable and high-speed mobile data connectivity. This is essential for applications that require constant and fast internet access. Additionally, the SoC includes support for various standard interfaces such as USB, I2C, and SPI, allowing for flexible connectivity with external devices and peripherals.

Power efficiency is a major design consideration for the QSC-1100-0-284. The SoC is engineered to minimize power consumption while delivering high performance, which helps extend battery life in portable devices and reduce energy costs in embedded systems. The power management features ensure that the SoC operates efficiently without generating excessive heat.

The QSC-1100-0-284 is housed in a Chip Scale Package (CSP), which offers a compact form factor. This design is ideal for space-constrained applications, allowing for efficient use of space while maintaining reliable electrical and thermal performance. The CSP package ensures that the SoC can be integrated into small devices without compromising functionality.

The SoC is also designed to operate across a wide temperature range, from -40°C to +85°C. This broad temperature range ensures that the QSC-1100-0-284 can perform reliably in various environmental conditions, making it suitable for use in industrial, automotive, and consumer electronics applications.

In summary, the Qualcomm QSC-1100-0-284CSP-MT-03 is a versatile and high-performance SoC that integrates advanced processing, connectivity, and power efficiency features. Its compact design and broad application range make it a robust choice for modern communication and embedded systems.


Specification parameters

The Qualcomm QSC-1100-0-284CSP-MT-03 is defined by the following specifications:

  1. Processor Configuration: The SoC features a multi-core CPU. While specific details on core count and clock speeds may vary, the CPU is designed to handle a variety of processing tasks, from communication functions to multimedia processing.

  2. Graphics Processing Unit (GPU): Integrated GPU supports advanced graphics processing. The GPU is optimized for handling high-resolution displays and multimedia content, providing smooth performance for graphical applications.

  3. Connectivity Support:

    • Cellular Standards: Supports 3G and 4G LTE networks for reliable mobile data connectivity.

    • Additional Interfaces: Includes standard interfaces such as USB, I2C, and SPI, enabling connectivity with peripheral devices and external components.

  4. Memory Support: The SoC supports memory technologies such as LPDDR2 or LPDDR3. Specific details about maximum memory capacity and bandwidth are typically outlined in the datasheet.

  5. Power Consumption: The QSC-1100-0-284 is designed for low power consumption, with power usage optimized to enhance battery life and reduce heat generation. Detailed power consumption figures should be checked in the datasheet.

  6. Package Type: The SoC is available in a Chip Scale Package (CSP) with a compact design. The CSP configuration ensures efficient use of space and reliable performance in compact applications.

  7. Temperature Range: The SoC is designed to operate within a temperature range suitable for various environments, typically from -40°C to +85°C, ensuring reliability in diverse operating conditions.


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