Product description
The Qualcomm QSC-1105-1-297CSP-MT-01-0 is a sophisticated System on Chip (SoC) that integrates a range of functionalities into a compact package, making it well-suited for advanced communication and processing applications. The SoC’s design focuses on delivering high performance, efficient power management, and robust connectivity.
At the heart of the QSC-1105-1-297CSP-MT-01-0 is a multi-core CPU, which provides the processing power needed for a variety of tasks. This configuration ensures that the SoC can handle both general computing tasks and more demanding applications. The specific core count and clock speeds are optimized to balance performance with power efficiency.
The integrated GPU enhances the SoC’s capabilities by providing advanced graphics processing. This allows the QSC-1105-1-297CSP-MT-01-0 to support high-resolution displays and handle complex visual effects, making it ideal for applications involving multimedia content and high-quality graphics.
Connectivity is a key strength of the QSC-1105-1-297CSP-MT-01-0. It supports 3G and 4G LTE standards, ensuring reliable and fast mobile data connectivity. This is crucial for applications that depend on consistent internet access. Additionally, the SoC includes support for various standard interfaces such as USB, I2C, and SPI, providing flexibility for connecting external peripherals and devices.
Power efficiency is a major design consideration for the QSC-1105-1-297CSP-MT-01-0. The SoC is engineered to minimize power consumption, which helps extend battery life in portable devices and reduce energy costs in embedded systems. Its efficient power management also contributes to reduced heat generation, enhancing overall system reliability.
The QSC-1105-1-297CSP-MT-01-0 is housed in a Chip Scale Package (CSP), offering a compact and space-efficient design. This packaging is particularly advantageous for applications with limited space, allowing the SoC to be integrated into smaller devices without compromising performance. The CSP design also ensures reliable electrical connections and effective thermal management.
Additionally, the SoC is designed to operate across a wide temperature range, from -40°C to +85°C. This broad range of operational temperatures ensures that the QSC-1105-1-297CSP-MT-01-0 performs reliably in various environmental conditions, making it suitable for a range of applications from industrial to consumer electronics.
In summary, the Qualcomm QSC-1105-1-297CSP-MT-01-0 is a versatile and high-performance SoC that combines advanced processing, connectivity, and power efficiency features into a compact package. Its design makes it well-suited for a wide array of modern communication and embedded systems, providing reliable performance across diverse applications.
Specification parameters
Processor Configuration: The SoC features a multi-core CPU configuration. Details about the specific number of cores and clock speeds are outlined in the datasheet, but the CPU is designed to handle a range of processing tasks efficiently.
Graphics Processing Unit (GPU): The integrated GPU supports advanced graphics processing, making it suitable for applications requiring high-resolution displays and complex visual effects. The GPU's specifications, including performance metrics and supported resolutions, are detailed in the datasheet.
Connectivity Features:
Cellular: Supports 3G and 4G LTE for high-speed mobile data connectivity.
Additional Interfaces: Includes standard communication interfaces such as USB, I2C, and SPI, allowing for connectivity with a variety of external devices and peripherals.
Memory Support: The SoC supports memory technologies such as LPDDR2 or LPDDR3. Specific details regarding maximum memory capacity and bandwidth are provided in the datasheet.
Power Consumption: The QSC-1105-1-297CSP-MT-01-0 is engineered for low power usage, which is crucial for extending battery life and managing thermal output. Power consumption details are outlined in the datasheet.
Package Type: The SoC is housed in a Chip Scale Package (CSP) with a compact footprint. This packaging allows for efficient use of space and reliable performance in small form factor applications.
Temperature Range: Designed to operate within a temperature range typically from -40°C to +85°C, making it suitable for various environmental conditions and ensuring reliable performance in diverse settings.
