System on Chip (SoC)

SM-8250-1-MPSP1017-TR-02-0-AC

  • High-Performance CPU: The SM-8250 features a multi-core CPU architecture that delivers exceptional processing power for demanding applications.
  • Advanced GPU: Equipped with a powerful graphics processing unit (GPU), the chip supports high-quality graphics rendering, making it suitable for gaming and multimedia applications.
  • Integrated AI Capabilities: The SoC includes dedicated AI processing units, enabling efficient machine learning and artificial intelligence tasks directly on the device.

Product description

The Qualcomm SM-8250-1-MPSP1017-TR-02-0-AC is engineered to meet the high demands of modern mobile computing and communication. Its high-performance CPU architecture, featuring an octa-core design, allows for efficient multitasking and smooth operation of resource-intensive applications. The configuration typically includes a combination of high-performance cores for demanding tasks and efficiency cores for lighter workloads, ensuring optimal performance across various scenarios.

The integrated Adreno GPU is a standout feature of the SM-8250, providing exceptional graphics performance for gaming, video playback, and augmented reality applications. This capability is crucial for delivering immersive experiences in mobile gaming and high-definition video streaming, making the SoC a preferred choice for premium smartphones and tablets.

One of the key advancements in the SM-8250 is its integrated AI capabilities. The Qualcomm Hexagon DSP enables efficient processing of AI tasks, allowing for features such as real-time image processing, voice recognition, and enhanced camera functionalities. This integration of AI directly into the SoC enhances the overall user experience by enabling smarter applications that can learn and adapt to user behavior.

The SM-8250 also supports advanced 5G connectivity, which is essential for modern mobile devices. With support for both sub-6 GHz and mmWave bands, the SoC ensures high-speed internet access and low latency, enabling seamless streaming, gaming, and communication experiences. This capability is particularly important as the world moves towards more connected devices and services.

Energy efficiency is a critical aspect of the SM-8250's design. The chip is optimized to deliver high performance while minimizing power consumption, which is vital for extending battery life in mobile devices. This efficiency is achieved through various power management techniques that dynamically adjust performance based on the device's workload.

Security is another paramount concern in mobile computing, and the SM-8250 addresses this with robust security features. The SoC includes hardware-based security measures to protect sensitive data and ensure secure transactions, which is increasingly important in today's digital landscape.

In summary, the Qualcomm SM-8250-1-MPSP1017-TR-02-0-AC is a powerful and versatile system-on-chip that combines high-performance processing, advanced graphics capabilities, integrated AI, and robust security features. Its support for 5G connectivity and energy efficiency makes it an ideal choice for next-generation mobile devices, enabling a wide range of applications from gaming to smart home technology.


Specification parameters

  • Chip Type: SM-8250

  • Package Type: MPSP1017

  • CPU Architecture: Octa-core (1+3+4 configuration) with high-performance and efficiency cores

  • GPU: Adreno graphics processor for high-quality graphics rendering

  • AI Engine: Qualcomm Hexagon DSP for AI and machine learning tasks

  • Connectivity: Integrated 5G modem with support for sub-6 GHz and mmWave bands

  • Memory Support: LPDDR5 RAM support for high-speed memory access

  • Storage Interface: UFS 3.1 support for fast storage solutions

  • Operating Temperature Range: Designed to operate in a wide temperature range suitable for various environments

  • Power Supply Voltage: Typically operates at 3.3V


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