Charging IC

SMB-1355-0-36BWLNSP-TR-00-0-00

  • High Efficiency: The module is optimized for high power efficiency, which translates to longer battery life in portable devices and reduced energy consumption in larger systems.
  • Compact Design: Its compact form factor allows for integration into small or space-constrained devices without compromising on performance.
  • Robust Performance: Equipped to handle demanding communication tasks, it offers robust performance in various operational conditions, ensuring reliable connectivity and signal integrity.

Product description

The Qualcomm SMB-1355-0-36BWLNSP-TR-00-0-00 is a high-performance wireless module designed to meet the needs of modern communication systems. It integrates advanced technology to deliver superior signal processing and communication capabilities.


Construction: The module is built with high-quality materials and incorporates advanced circuitry that supports high-speed data transmission and minimal signal loss. Its construction is optimized for durability and reliability, making it suitable for both consumer and industrial applications.


Applications: Commonly used in advanced wireless communication systems, including but not limited to mobile devices, IoT (Internet of Things) applications, and automotive systems. Its design supports seamless integration into complex systems where reliable wireless connectivity is critical.


Ease of Integration: Designed with an emphasis on ease of integration, the SMB-1355-0-36BWLNSP-TR-00-0-00 comes with comprehensive documentation and support to assist engineers and developers in incorporating the module into their designs efficiently.


This module represents Qualcomm's commitment to delivering high-performance solutions tailored to the evolving needs of modern wireless technology.


Specification parameters

The Qualcomm SMB-1355-0-36BWLNSP-TR-00-0-00 has specific technical specifications that define its operational capabilities:

  • Frequency Range: Designed to operate within a specific frequency range to accommodate various communication standards and requirements.

  • Power Output: Provides optimal power output levels suitable for maintaining strong and consistent signal transmission.

  • Interface Compatibility: Compatible with a range of interfaces, enabling seamless integration with different systems and hardware setups.

  • Operating Temperature: Rated to function reliably across a wide temperature range, ensuring stable performance in diverse environmental conditions.

  • Size and Dimensions: Features precise dimensions tailored for specific applications, balancing size constraints with performance needs.


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