Product description
The Qualcomm SMB-1357-0-30CWLCSP-HR-05-0-07 is a high-performance wireless module engineered for demanding communication needs.
Design and Build: The module utilizes advanced CWLCSP (Chip-on-Wafer-Large-Contact-Size Package) technology, which enhances its durability and performance. This packaging method allows for a high-density arrangement of interconnects, optimizing signal transmission and heat management. The design is aimed at providing robust performance in compact and high-demand applications.
Performance Characteristics: The SMB-1357-0-30CWLCSP-HR-05-0-07 excels in maintaining signal fidelity and supporting high data rates. It is designed to handle significant data throughput efficiently, making it suitable for real-time applications such as video streaming and high-speed data transfer. Its thermal management features ensure that the module remains operational even under high thermal loads.
Application Versatility: This module is versatile and can be used in a range of devices, from consumer electronics like mobile phones and smart gadgets to more complex systems such as automotive communications and industrial automation. Its high performance and compact size make it adaptable to various use cases.
Integration and Support: Qualcomm provides extensive documentation and support for the SMB-1357-0-30CWLCSP-HR-05-0-07. This includes detailed integration guides, design recommendations, and technical support to assist engineers in incorporating the module into their systems efficiently and achieving optimal performance.
In summary, the Qualcomm SMB-1357-0-30CWLCSP-HR-05-0-07 combines enhanced signal fidelity, high data rate support, and effective thermal management in a compact package, making it a robust choice for a wide range of high-performance wireless communication applications.
Specification parameters
Frequency Coverage: Operates across a wide frequency range to support various wireless communication standards and applications, enhancing versatility.
Package Type: Features a Chip-on-Wafer-Large-Contact-Size Package (CWLCSP), which provides high-density interconnects and efficient thermal dissipation.
Power Requirements: Designed to work within precise voltage and current specifications to ensure reliable performance and power efficiency.
Temperature Tolerance: Capable of functioning within a broad temperature range, making it suitable for use in various environmental conditions.
Dimensions: The compact dimensions of the CWLCSP package make it ideal for integration into space-constrained designs while providing high performance.
