Charging IC

SMB-1357-0-30CWLCSP-HR-05-1-10

  • Advanced Integrated Technology: The Qualcomm SMB-1357-0-30CWLCSP-HR-05-1-10 leverages Qualcomm's cutting-edge technology to provide high-performance capabilities. It is designed to deliver exceptional functionality and efficiency.
  • Compact Package: This module features a compact package with a Ball Grid Array (BGA) design, making it suitable for applications where space is limited while still delivering high performance.
  • High Reliability: Known for its robust construction, the module is engineered to offer reliable operation across various conditions, ensuring consistent performance in demanding applications.

Product description

The Qualcomm SMB-1357-0-30CWLCSP-HR-05-1-10 is a sophisticated module designed to provide high-performance capabilities with Qualcomm's advanced technology. Its compact BGA (Ball Grid Array) package is engineered for applications where space constraints are a concern, making it an ideal choice for modern, space-sensitive designs.


In terms of specifications, the module operates within a specific frequency range tailored to meet the demands of high-frequency applications. It is optimized for low power consumption, which is crucial for energy-efficient designs and applications that are sensitive to power usage.


The SMB-1357-0-30CWLCSP-HR-05-1-10’s compact dimensions, combined with its BGA package, allow for efficient integration into various devices and systems. The specific connector type used ensures reliable and stable connections, which is essential for maintaining consistent performance.


Additionally, the module is built to perform reliably across a wide temperature range, making it versatile for use in different environmental conditions, from harsh outdoor settings to controlled indoor environments.


Overall, the Qualcomm SMB-1357-0-30CWLCSP-HR-05-1-10 stands out for its integration of advanced technology, compact design, and reliable performance, making it an excellent choice for high-performance and space-constrained applications.


Specification parameters

  • Frequency Range: The SMB-1357-0-30CWLCSP-HR-05-1-10 operates within a specific frequency range optimized for its intended applications, ensuring reliable signal processing and communication.

  • Power Consumption: The module is designed for low power consumption, balancing performance with energy efficiency. This makes it suitable for battery-operated devices and applications with stringent power requirements.

  • Physical Dimensions: It features a compact form factor, specifically a BGA package, which is crucial for integration into systems with limited space while maintaining high performance.

  • Connector Type: This module utilizes a specific connector type that ensures stable and reliable electrical connections, contributing to its overall performance and integration ease.

  • Operating Temperature Range: The SMB-1357-0-30CWLCSP-HR-05-1-10 is designed to operate effectively across a broad temperature range, making it suitable for various environmental conditions.


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