Charging IC

SMB-1357-0-30CWLCSP-TR-05-0-00

  • High Integration and Compact Design:
  • The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-00 is designed with high integration in mind, allowing for a compact package that minimizes board space while maximizing functionality. This makes it ideal for applications where space is a constraint but performance is crucial.
  • Enhanced Performance:
  • This component is engineered to deliver superior performance in terms of speed and reliability. It supports advanced features and high-speed data processing, making it suitable for demanding applications in wireless communication and other high-performance scenarios.

Product description

Purpose and Application:
The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-00 is primarily used in advanced communication systems where high speed and efficiency are required. It is suitable for applications in mobile devices, IoT (Internet of Things) solutions, and other high-performance electronic systems.


Advanced Technology Integration:
This component incorporates advanced technology that enables it to handle complex tasks such as high-speed data transfer and efficient power management. The integration of these technologies ensures that the device operates reliably under various conditions and meets modern communication standards.


Design and Construction:
The Wafer-Level Chip-Scale Package (WLCSP) design of the SMB-1357-0-30CWLCSP-TR-05-0-00 allows for a highly compact and efficient layout. This design minimizes signal loss and enhances the overall performance of the component. The small size of the package also makes it ideal for integration into space-constrained applications.


Quality and Reliability:
Qualcomm’s rigorous quality standards ensure that the SMB-1357-0-30CWLCSP-TR-05-0-00 is built to be reliable and durable. The component undergoes extensive testing to meet industry standards and provide consistent performance over its operational life.


Overall, the Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-00 stands out for its high integration, performance efficiency, and suitability for modern communication applications.


Specification parameters

Package Type:
The SMB-1357-0-30CWLCSP-TR-05-0-00 comes in a Wafer-Level Chip-Scale Package (WLCSP), which is known for its small footprint and high performance. The TR-05-0-00 designates the tape and reel packaging, facilitating automated assembly processes.

Dimensions:
The exact dimensions of the WLCSP package are critical for fitting the component onto a circuit board. Typically, such packages are very small, with dimensions on the order of millimeters, contributing to the overall compactness of the device.

Operating Frequency:
This component supports specific operating frequencies, crucial for its performance in communication tasks. While the exact frequency range would be detailed in the datasheet, it is generally designed to handle high frequencies for optimal performance.

Power Supply Requirements:
The SMB-1357-0-30CWLCSP-TR-05-0-00 operates within a defined voltage range, which ensures its compatibility with various power sources. The power supply requirements are tailored to balance performance and energy efficiency.

Temperature Range:
It is designed to operate within a specified temperature range, ensuring reliability under various environmental conditions. This is important for maintaining performance stability in different operating environments.


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