Charging IC

SMB-1357-0-30CWLCSP-TR-05-0-04

  • High Integration: The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-04 is designed with a high level of integration, combining multiple functionalities into a single package. This reduces the need for additional external components, thus saving space and minimizing overall system complexity.
  • Low Power Consumption: This component is engineered for low power consumption, which is crucial for battery-operated devices. It helps in extending the battery life of portable electronics and reducing energy costs in other applications.
  • Advanced Performance: The chip is built to deliver advanced performance in its intended applications. It typically includes optimized circuits for high-speed data processing, robust communication capabilities, and efficient signal handling.

Product description

The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-04 is a highly integrated, low-power semiconductor device designed to meet the needs of modern electronic systems. Its WLCSP packaging allows for a very compact design, making it ideal for use in space-constrained environments such as smartphones, tablets, and other portable devices.


In terms of functionality, this chip is typically employed in applications requiring efficient processing and communication capabilities. Its design emphasizes energy efficiency, which is crucial for extending the operational life of battery-powered devices. The high integration level means that it combines several functions into a single chip, reducing the need for additional components and simplifying the overall system design.


The chip's operating specifications ensure reliable performance across a range of conditions. The exact details of its frequency range, power requirements, and communication protocols are tailored to specific application needs, as detailed in the technical datasheet provided by Qualcomm.


Overall, the Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-04 is a versatile and efficient component that plays a critical role in advanced electronic systems, delivering both high performance and low power consumption in a compact form factor.


Specification parameters

  • Package Type: The SMB-1357-0-30CWLCSP-TR-05-0-04 is housed in a WLCSP (Wafer-Level Chip-Scale Package), which is a compact and space-efficient package type. WLCSP packages are known for their small footprint and excellent thermal and electrical performance.

  • Operating Voltage: The chip operates within a specific voltage range to ensure stable performance. For instance, it might have a nominal operating voltage of 1.8V or 3.3V, but the exact range would be specified in the datasheet.

  • Frequency Range: It supports a wide range of frequencies suitable for various applications. The exact frequency range would be detailed in the technical specifications, indicating its capability to handle different signal types and speeds.

  • Communication Interfaces: The chip may support multiple communication protocols such as SPI, I2C, or UART. The exact interfaces supported would be listed in the datasheet, providing flexibility in its integration into different systems.


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