Charging IC

SMB-1357-0-30CWLCSP-TR-05-0-06

  • High Efficiency: The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-06 is designed to deliver high efficiency, which is crucial for applications requiring reliable and consistent performance.
  • Compact Design: The component features a compact and low-profile design, which allows it to be integrated into space-constrained environments, making it suitable for modern electronic devices with limited board space.
  • Low Power Consumption: It operates with low power consumption, contributing to the overall energy efficiency of the device in which it is used.

Product description

The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-06 is a highly integrated component designed for advanced electronic applications. It utilizes a Wafer-Level Chip Scale Package (WLCSP) which is a type of package technology that minimizes the size of the component while providing efficient electrical and thermal performance. This technology involves packaging the semiconductor die directly on the PCB, offering significant space-saving benefits compared to traditional packaging methods.


The component is designed for applications requiring high efficiency and reliability, such as mobile devices, wearable technology, or other compact electronics. Its low power consumption ensures that it contributes to the overall energy efficiency of the device, which is essential for battery-powered applications. The SMB-1357-0-30CWLCSP-TR-05-0-06 is engineered to perform robustly under a variety of conditions, with an operational temperature range that allows it to function reliably in different environmental settings.


In summary, the Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-06 combines a compact form factor with high efficiency and robust performance, making it an ideal choice for modern electronic applications where space and power consumption are critical considerations.


Specification parameters

  • Package Type: The SMB-1357-0-30CWLCSP-TR-05-0-06 is packaged in a Chip-on-Board (COB) form factor, specifically a Wafer-Level Chip Scale Package (WLCSP). This packaging method is known for its minimal footprint and efficient thermal performance.

  • Pin Count: The device typically features a small number of pins due to its compact size, which simplifies the PCB layout and reduces the overall device size.

  • Operating Voltage: The exact operating voltage range can vary depending on the specific application, but this component is generally designed to operate within standard low-voltage ranges suitable for integrated circuits.

  • Operating Temperature Range: The component is built to operate reliably within a specified temperature range, ensuring its functionality across different environmental conditions.

  • Data Rate: The data rate or communication speed supported by the SMB-1357-0-30CWLCSP-TR-05-0-06 is optimized for high-speed data transfer, aligning with the needs of modern communication systems.


Product view

Related products