Product description
The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-07 is a sophisticated electronic component characterized by its wafer-level chip-scale package (WLCSP). This advanced packaging technology is known for its minimal size and excellent thermal and electrical performance. By directly mounting the semiconductor die onto the PCB, the WLCSP reduces the component's footprint and provides efficient heat dissipation, which is crucial for maintaining performance and reliability in compact designs.
This component is particularly well-suited for applications in mobile devices, wearables, and other electronics where space and power efficiency are critical. Its low power consumption makes it ideal for battery-operated devices, helping to prolong battery life while ensuring high operational efficiency. The SMB-1357-0-30CWLCSP-TR-05-0-07 is built to deliver consistent performance across a range of environmental conditions, making it a versatile choice for various electronic applications.
In summary, the Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-07 combines a compact, wafer-level chip-scale package with high performance and low power consumption, making it an excellent component for space-constrained and energy-efficient applications. Its robust design ensures reliable operation in diverse conditions, meeting the needs of modern electronic devices.
Specification parameters
Package Type: Wafer-Level Chip-Scale Package (WLCSP). This packaging technique provides a compact and efficient solution for high-density applications.
Pin Count: The component typically has a low pin count due to its small size, which simplifies the PCB design and allows for a smaller overall device footprint.
Operating Voltage: The SMB-1357-0-30CWLCSP-TR-05-0-07 operates within standard low-voltage ranges suited for modern integrated circuits.
Operating Temperature Range: It is designed to operate reliably within a specified temperature range, ensuring functionality in various environmental conditions.
Data Rate/Speed: The device supports high-speed data transfer rates appropriate for advanced communication and processing applications.
