Product description
The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-10 is a state-of-the-art component encapsulated in a Wafer-Level Chip-Scale Package (WLCSP). This advanced packaging method involves mounting the semiconductor die directly onto the PCB, allowing for a very compact package with minimal footprint. The WLCSP design not only reduces the physical size of the component but also provides efficient thermal and electrical performance, which is crucial for maintaining reliability and performance in small electronic devices.
This component is optimized for high-performance applications, delivering efficient processing and high-speed data handling capabilities. Its low power consumption is a key feature, making it ideal for use in battery-operated devices where extending battery life is essential. The robust thermal management provided by the WLCSP package ensures that the component operates effectively even in environments where heat dissipation could otherwise be a concern.
The Qualcomm SMB-1357-0-30CWLCSP-TR-05-0-10 is well-suited for integration into compact, high-performance electronics such as smartphones, wearables, and other modern devices. Its design supports a broad operating temperature range, ensuring reliable operation in various conditions. Overall, this component combines a compact form factor with high efficiency and reliable performance, addressing the needs of contemporary electronic applications.
Specification parameters
Package Type: Wafer-Level Chip-Scale Package (WLCSP), which is a small, high-density packaging format that minimizes the footprint of the component while maintaining effective thermal and electrical performance.
Pin Count: The device is likely to have a low pin count due to its small package size, streamlining the PCB design and contributing to a more compact end product.
Operating Voltage: It operates within a low voltage range, typical for modern integrated circuits, ensuring compatibility with various electronic systems while contributing to energy efficiency.
Operating Temperature Range: The component is designed to function reliably over a specified temperature range, allowing it to perform effectively in different environmental conditions.
Data Rate/Speed: Supports high-speed data rates necessary for advanced processing and communication tasks, enhancing the performance of devices that incorporate this component.
