Product description
The Qualcomm SMB-1358-0-30CWLCSP-HR-05-0-06 is an advanced electronic component encapsulated in a Wafer-Level Chip-Scale Package (WLCSP). This packaging method involves mounting the semiconductor die directly onto the printed circuit board (PCB), resulting in a very compact and space-efficient package. The WLCSP technology helps minimize the component's footprint while providing effective thermal management and electrical performance, which is crucial for maintaining reliability and performance in small electronic devices.
This component is designed for high-performance applications, offering efficient processing capabilities and supporting high-speed data transfer. Its low power consumption is particularly advantageous for battery-powered devices, where extending battery life and reducing energy usage are important considerations. The SMB-1358-0-30CWLCSP-HR-05-0-06 is built to operate reliably across a range of temperatures, ensuring that it can function effectively in various environmental conditions.
Overall, the Qualcomm SMB-1358-0-30CWLCSP-HR-05-0-06 combines a compact, space-saving design with high performance and low power consumption, making it well-suited for integration into modern electronic devices such as smartphones, wearables, and other compact technology. Its robust construction and efficient design contribute to its reliability and effectiveness in diverse applications.
Specification parameters
Package Type: Wafer-Level Chip-Scale Package (WLCSP), which is a compact packaging format that provides a minimal footprint and efficient thermal and electrical performance.
Pin Count: The device features a small number of pins due to its compact design, which simplifies PCB layout and reduces the overall size of the final product.
Operating Voltage: It operates within a standard low voltage range, suitable for modern electronic circuits and ensuring compatibility with a variety of systems.
Operating Temperature Range: The SMB-1358-0-30CWLCSP-HR-05-0-06 is designed to function effectively within a specific temperature range, allowing it to perform reliably in diverse environmental conditions.
Data Rate/Speed: It supports high-speed data transfer rates, which are essential for applications requiring rapid data processing and communication.
