Product Description
The Qualcomm SMB-1358-0-30CWLCSP-TR-05-0-01 is a highly integrated semiconductor component intended for use in advanced electronics. Its Wafer-Level Chip-Scale Package (WLCSP) allows for a compact and lightweight design while maintaining robust performance.
Construction: The WLCSP construction means that the chip is directly mounted on the PCB with very minimal packaging, providing a lower profile and shorter interconnect paths which are crucial for high-speed applications.
Application: This part is designed to excel in applications requiring high performance with minimal power consumption. It is suitable for use in mobile devices, wearables, and other compact electronic devices where space and power efficiency are critical.
Performance: Its low power operation contributes to longer battery life in portable devices, while its high integration supports sophisticated functionalities within a small footprint. The chip is built to handle demanding tasks with efficient data processing and communication capabilities.
For the most accurate and detailed information, including electrical characteristics, pin configuration, and exact operating parameters, refer to the official Qualcomm datasheet for the SMB-1358-0-30CWLCSP-TR-05-0-01.
Specification
Package Type: WLCSP (Wafer-Level Chip-Scale Package)
Package Size: The exact dimensions of the package are not typically specified in this part number alone but WLCSP packages are generally very small, allowing for high-density mounting on PCBs.
Operating Voltage: The SMB-1358-0-30CWLCSP-TR-05-0-01 operates at a low voltage, which is crucial for minimizing power consumption. Specific voltage levels would need to be referenced in the detailed datasheet for accurate values.
Temperature Range: Designed to function within a broad temperature range, making it suitable for various environmental conditions. Specific operating and storage temperature ranges are detailed in the datasheet.
Frequency Range: While the exact frequency range may not be listed in the part number, it typically supports a broad range of frequencies suitable for wireless communication applications.
Interface: The component likely supports standard communication interfaces relevant to its intended use, such as SPI, I2C, or other protocols, but exact details should be verified from the datasheet.
