Charging IC

SMB-1358-0-30CWLCSP-TR-05-0-03

  • Compact Package: The SMB-1358-0-30CWLCSP-TR-05-0-03 is designed in a wafer-level chip-scale package (WLCSP), which is known for its small footprint and high integration density. This compact packaging allows for efficient use of space on a printed circuit board (PCB), making it suitable for mobile and other space-constrained applications.
  • High Performance: This component is engineered to deliver high performance in its specific application. It typically features optimized electrical characteristics to ensure efficient operation and reliable performance in communication systems or electronic devices.

Product description

The Qualcomm SMB-1358-0-30CWLCSP-TR-05-0-03 is a highly integrated semiconductor device used primarily in communication applications. Its wafer-level chip-scale package (WLCSP) design contributes to its compact size and high performance. This component is commonly utilized in modern electronics where space efficiency and performance are critical, such as in smartphones, tablets, and other portable devices.


Electrical Characteristics: The chip is designed with specific electrical parameters to meet the needs of its applications. This includes aspects like impedance, capacitance, and signal integrity, which are carefully optimized to ensure reliable performance.


Thermal Management: Given its high performance and small size, the chip is engineered with thermal management features to dissipate heat effectively. This prevents overheating and maintains stable operation over its temperature range.


Integration: The SMB-1358-0-30CWLCSP-TR-05-0-03 may integrate multiple functions within a single chip, reducing the need for external components and simplifying the overall design of the electronic system.


For precise information on pinout, detailed electrical characteristics, and application-specific guidelines, the component's datasheet should be consulted. This document provides comprehensive details necessary for integrating the SMB-1358-0-30CWLCSP-TR-05-0-03 into your designs.


Specification parameters

  • Package Type: WLCSP (Wafer-Level Chip-Scale Package). This type of package is characterized by its small size and high density of connections. The specific package dimensions and pin count can vary, but WLCSP packages generally offer a compact form factor.

  • Pin Count: The SMB-1358-0-30CWLCSP-TR-05-0-03 typically includes a specific number of pins that provide the necessary electrical connections for its functionality. The exact pin count is determined by the design requirements of the chip.

  • Operating Frequency: The chip's operating frequency or range is critical for its intended use. This specification determines the speed at which the chip can operate and process signals. The exact frequency range will be detailed in the datasheet.

  • Voltage Supply: This component operates within a specific voltage range. The supply voltage requirements must be adhered to in order to ensure proper functionality and avoid damage.

  • Temperature Range: The SMB-1358-0-30CWLCSP-TR-05-0-03 is designed to function within a specified temperature range, ensuring reliable operation in various environmental conditions.


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