Product description
The Qualcomm SMB-1360 is a highly integrated system-on-chip (SoC) solution designed for small cells and other wireless infrastructure applications. It combines a baseband processor, a radio frequency (RF) transceiver, and a power management unit (PMU) into a single package, which helps to reduce the complexity and cost of wireless infrastructure deployments.
The SMB-1360 supports frequency bands from 600 MHz to 3.8 GHz, making it suitable for use in a wide range of wireless networks, including LTE, WCDMA, and GSM. The baseband processor supports LTE, WCDMA, and GSM standards, while the RF transceiver supports up to 4x4 MIMO and carrier aggregation.
The integrated PMU provides efficient power delivery to the various components of the system, which helps to reduce power consumption and improve overall system efficiency. The SMB-1360 is available in a 12x12 mm flip-chip package, making it easy to integrate into a wide range of wireless infrastructure applications.
Overall, the Qualcomm SMB-1360 is a high-performance, low-power solution that is ideal for small cells and other wireless infrastructure applications where power efficiency is critical. Its advanced features, such as MIMO and carrier aggregation, can help to improve network capacity and throughput, making it an ideal solution for next-generation wireless networks.
Specification parameters
Frequency Bands: The SMB-1360 supports frequency bands from 600 MHz to 3.8 GHz.
Baseband Processor: The baseband processor supports LTE, WCDMA, and GSM standards.
RF Transceiver: The RF transceiver supports up to 4x4 MIMO and carrier aggregation.
Power Management: The integrated PMU provides efficient power delivery to the various components of the system.
Package: The SMB-1360 is available in a 12x12 mm flip-chip package.