Product description
The Qualcomm SMB-1360-0-30DWLNSP-TR-03-0-36 is a high-performance RF component designed for applications where high sensitivity and low noise are crucial. It is enclosed in a compact and robust package, which makes it suitable for integration into high-density circuit designs.
RF Performance: The SMB-1360-0-30DWLNSP-TR-03-0-36 is engineered to deliver exceptional RF performance with a focus on high sensitivity and minimal noise. This capability makes it ideal for use in advanced communication systems, precision instrumentation, and other applications requiring high signal accuracy and integrity.
Thermal Management: The component’s packaging is designed to support effective thermal management, which is essential for high-power or high-frequency applications. The package aids in heat dissipation, helping to maintain performance and reliability by preventing overheating.
Compact and Durable Design: Its compact design allows for space-efficient integration into various circuit layouts. The robust packaging ensures durability and protection against mechanical stress and environmental factors, enhancing the component's reliability and longevity.
Versatility and Integration: The advanced RF technology integrated into the SMB-1360-0-30DWLNSP-TR-03-0-36 allows it to be used in a wide range of demanding applications. The high level of integration reduces the need for additional external components, simplifying system design and improving overall reliability.
For detailed information about the SMB-1360-0-30DWLNSP-TR-03-0-36, including its electrical characteristics, operational parameters, and application guidelines, consulting the datasheet provided by Qualcomm is recommended. The datasheet contains comprehensive details about the component’s specifications and performance metrics.
Specification parameters
Package Type: The SMB-1360-0-30DWLNSP-TR-03-0-36 comes in a specialized package format designed to meet high-performance RF application needs. The exact package dimensions, type, and features are detailed in the datasheet, ensuring compatibility with various PCB designs and thermal management solutions.
Operating Frequency Range: The component operates within a specified frequency range that is tailored for its RF applications. Detailed frequency range and bandwidth information are provided in the datasheet, which is crucial for ensuring that the component meets the specific requirements of high-frequency applications.
Voltage and Power Requirements: The SMB-1360-0-30DWLNSP-TR-03-0-36 has defined voltage and power requirements necessary for proper operation. Adhering to these specifications is crucial to avoid potential damage and ensure optimal performance. The datasheet provides comprehensive details on the required operating voltage and power levels.
Thermal Specifications: Designed to function within a broad temperature range, the component maintains stable performance under various environmental conditions. The datasheet provides information on the maximum operating temperature and other thermal characteristics, which are essential for ensuring reliability in different operating environments.
Impedance Matching: The SMB-1360-0-30DWLNSP-TR-03-0-36 features impedance matching capabilities to minimize signal reflections and ensure efficient power transfer. Proper impedance matching is key to maintaining signal integrity and optimizing overall system performance.
