Charging IC

SMB-1396-0-WLPSP100-TR-02-0

  • High Integration: The SMB-1396-0-WLPSP100-TR-02-0 is designed to provide high integration, combining multiple functionalities into a single package. This integration helps in reducing the overall size of the system and improving efficiency.
  • Low Power Consumption: This component is engineered to operate with minimal power, making it suitable for battery-powered and energy-efficient devices. Its low power consumption is crucial for extending the operational lifespan of portable electronics.

Product Description

The Qualcomm SMB-1396-0-WLPSP100-TR-02-0 is a sophisticated module engineered to meet the demanding requirements of modern electronic and communication systems. This component is part of Qualcomm's extensive portfolio, known for delivering cutting-edge technology with high performance and reliability.


Design and Construction: The module is constructed with advanced materials and design techniques to ensure durability and optimal performance. Its compact form factor allows for easy integration into various electronic devices without occupying excessive space.


Application Areas: It is suitable for a wide range of applications, including mobile communication devices, IoT gadgets, and other electronic systems where robust connectivity and low power consumption are critical. Its versatility makes it an attractive choice for designers seeking to incorporate high-performance communication capabilities into their products.


Performance Characteristics: The SMB-1396-0-WLPSP100-TR-02-0 excels in delivering stable and reliable performance. Its low power consumption contributes to longer battery life in portable devices, while its high-frequency operation and data rate capabilities support advanced communication standards.


For exact technical details, such as precise voltage ranges, frequency specifications, and temperature limits, consulting the official datasheet or technical documentation from Qualcomm is recommended. This documentation will provide comprehensive information necessary for detailed design and implementation.


Specification

  • Frequency Range: The component operates across a broad frequency range, ensuring compatibility with various communication standards and applications.

  • Voltage Supply: It typically operates within a specified voltage range, making it adaptable to different power supply conditions. The exact voltage range should be referenced from the technical datasheet for precise values.

  • Package Type: The component is usually available in a small, surface-mount package format, which facilitates easy integration into compact circuit designs.

  • Temperature Range: Designed to function effectively within a defined temperature range, ensuring reliable operation under varying environmental conditions.

  • Data Rate: Capable of supporting high data rates, which is essential for applications requiring fast and efficient data processing.


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